基于系统级封装应用(SOP)的FDTD/MRTD分析和设计硅/LTCC封装中的MEMS和嵌入式元件

2003 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2003. Digest of Papers. Pub Date : 2003-04-11 DOI:10.1109/SMIC.2003.1196689

M. Tentzeris, N. Bushyager, J. Laskar, G. Zheng, J. Papapolymerou

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引用次数: 15

摘要

FDTD和MRTD全波数值技术应用于硅封装中嵌入式元件(如MEMS)的建模和分析。对最小串扰传输线、宽带紧凑型转换、MEMS开关以及可用于实际调谐应用和封装自适应天线的初步设计规则进行了推导。

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Analysis and design of MEMS and embedded components in silicon/LTCC packages using FDTD/MRTD for system-on-package applications (SOP)

The FDTD and MRTD full-wave numerical techniques are applied to the modeling and analysis of embedded components, such as MEMS, in silicon packages. Preliminary design rules are derived for minimized-crosstalk transmission lines, for a wideband compact transition, for a MEMS switch and that can be used in practical tuning applications and for a packaging adaptive antenna.

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来源期刊

2003 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2003. Digest of Papers.

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