L. Pirro, I. Ionica, S. Cristoloveanu, G. Ghibaudo
{"title":"裸SOI晶圆中的低频噪声:实验与模型","authors":"L. Pirro, I. Ionica, S. Cristoloveanu, G. Ghibaudo","doi":"10.1109/ESSDERC.2015.7324770","DOIUrl":null,"url":null,"abstract":"Noise measurements are efficient for interface trap density characterization in MOSFETs and can be extended to bare silicon-on-insulator wafers. A physical model to explain the experimental results will be presented. The impact of measurement parameters, like die area and probe distance, is discussed comparing experimental and calculated characteristics. Important clarifications concerning the effective die area contributing to noise response will be pointed out.","PeriodicalId":332857,"journal":{"name":"2015 45th European Solid State Device Research Conference (ESSDERC)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Low-frequency noise in bare SOI wafers: Experiments and model\",\"authors\":\"L. Pirro, I. Ionica, S. Cristoloveanu, G. Ghibaudo\",\"doi\":\"10.1109/ESSDERC.2015.7324770\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Noise measurements are efficient for interface trap density characterization in MOSFETs and can be extended to bare silicon-on-insulator wafers. A physical model to explain the experimental results will be presented. The impact of measurement parameters, like die area and probe distance, is discussed comparing experimental and calculated characteristics. Important clarifications concerning the effective die area contributing to noise response will be pointed out.\",\"PeriodicalId\":332857,\"journal\":{\"name\":\"2015 45th European Solid State Device Research Conference (ESSDERC)\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-11-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 45th European Solid State Device Research Conference (ESSDERC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSDERC.2015.7324770\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 45th European Solid State Device Research Conference (ESSDERC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDERC.2015.7324770","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Low-frequency noise in bare SOI wafers: Experiments and model
Noise measurements are efficient for interface trap density characterization in MOSFETs and can be extended to bare silicon-on-insulator wafers. A physical model to explain the experimental results will be presented. The impact of measurement parameters, like die area and probe distance, is discussed comparing experimental and calculated characteristics. Important clarifications concerning the effective die area contributing to noise response will be pointed out.