Y. Naruke, T. Iwase, M. Takizawa, K. Saito, M. Asano, H. Nishimura, T. Mochizuki
{"title":"具有可编程冗余的16mb掩码ROM","authors":"Y. Naruke, T. Iwase, M. Takizawa, K. Saito, M. Asano, H. Nishimura, T. Mochizuki","doi":"10.1109/ISSCC.1989.48206","DOIUrl":null,"url":null,"abstract":"In response to demands for a mask ROM with large bit capacity, a 1M-word*16 bit mask ROM with 120-ns access time has been fabricated. A programmable redundancy technique utilizes electrically fusible polysilicon links with the secondary breakdown mechanism of a MOSFET for high production yield and small chip area. The memory cell matrix arranged in 8192 rows*2048 columns and is divided into four blocks by two sets of row decoders in order to reduce word line delay. The redundancy cell array is composed of 8 rows*256 columns which can replace four defective quarter-rows. The mask ROM is fabricated in single-polysilicon single-aluminium twin-well CMOS technology with 0.7- mu m photolithography for high bit density. The process parameters and design features of the mask ROM are given together with a block diagram.<<ETX>>","PeriodicalId":385838,"journal":{"name":"IEEE International Solid-State Circuits Conference, 1989 ISSCC. Digest of Technical Papers","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-02-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"A 16 Mb mask ROM with programmable redundancy\",\"authors\":\"Y. Naruke, T. Iwase, M. Takizawa, K. Saito, M. Asano, H. Nishimura, T. Mochizuki\",\"doi\":\"10.1109/ISSCC.1989.48206\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In response to demands for a mask ROM with large bit capacity, a 1M-word*16 bit mask ROM with 120-ns access time has been fabricated. A programmable redundancy technique utilizes electrically fusible polysilicon links with the secondary breakdown mechanism of a MOSFET for high production yield and small chip area. The memory cell matrix arranged in 8192 rows*2048 columns and is divided into four blocks by two sets of row decoders in order to reduce word line delay. The redundancy cell array is composed of 8 rows*256 columns which can replace four defective quarter-rows. The mask ROM is fabricated in single-polysilicon single-aluminium twin-well CMOS technology with 0.7- mu m photolithography for high bit density. The process parameters and design features of the mask ROM are given together with a block diagram.<<ETX>>\",\"PeriodicalId\":385838,\"journal\":{\"name\":\"IEEE International Solid-State Circuits Conference, 1989 ISSCC. Digest of Technical Papers\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-02-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE International Solid-State Circuits Conference, 1989 ISSCC. Digest of Technical Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.1989.48206\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE International Solid-State Circuits Conference, 1989 ISSCC. Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.1989.48206","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In response to demands for a mask ROM with large bit capacity, a 1M-word*16 bit mask ROM with 120-ns access time has been fabricated. A programmable redundancy technique utilizes electrically fusible polysilicon links with the secondary breakdown mechanism of a MOSFET for high production yield and small chip area. The memory cell matrix arranged in 8192 rows*2048 columns and is divided into four blocks by two sets of row decoders in order to reduce word line delay. The redundancy cell array is composed of 8 rows*256 columns which can replace four defective quarter-rows. The mask ROM is fabricated in single-polysilicon single-aluminium twin-well CMOS technology with 0.7- mu m photolithography for high bit density. The process parameters and design features of the mask ROM are given together with a block diagram.<>