A Survey Of Critical Metrology Needs For IC Interconnect Processes Based On Assessment By Quality Function Deployment (qfd) Methodology

Parallel surveys of users and suppliers were employed to evaluate matching of needs VS. product planning €or development of metrology tools and equipment to control IC chip to package interconnect processes. The surveys also compared actual supplier plans vs. a "rational behavior" model represented by a QFD customer requirement planning matrix. While general agreement is evident about needs to change from ouput measurements to in-line process control and pre-process problem prevention, both users and suppliers seem to be continuing use of outdated wire pull and visual inspection methods. This stalemate may be due to ineffective deployment of "voice of the customer" requirments into specific product plans and industry standards. QFD methods seem especially suitable for application to clarify emerging trends and to facilitate industry acceptance of appropriate new measurement technologies.