W. Brown, A. Elshabini, S. Ang, J. Balda, F. Barlow, R. Coubillion, A. Malshe, R. Malstrom, A. Mantooth, T. Martin, H. Naseem, R. Jones, W. Waite, R. Brown, N. Schmitt, D. Nutter, G. Salamo, L. Schaper, W. Schmidt, R. Selvam, S. Singh, K. Olejniczak, R. Ulrich, J. Yeargan, E. Yaz, W. White
{"title":"课程重组,以满足能源效率/可再生能源系统,无线和混合信号系统领域包装的关键需求","authors":"W. Brown, A. Elshabini, S. Ang, J. Balda, F. Barlow, R. Coubillion, A. Malshe, R. Malstrom, A. Mantooth, T. Martin, H. Naseem, R. Jones, W. Waite, R. Brown, N. Schmitt, D. Nutter, G. Salamo, L. Schaper, W. Schmidt, R. Selvam, S. Singh, K. Olejniczak, R. Ulrich, J. Yeargan, E. Yaz, W. White","doi":"10.1109/ECTC.2000.853338","DOIUrl":null,"url":null,"abstract":"The Electrical Engineering Department at University of Arkansas has been building considerable strength in Energy Efficiency/Renewable Energy Systems, Mixed-Signal, and Wireless Packaging areas. This effort is in coordination with critical other Departments within the College of Engineering; specifically Industrial Engineering and Mechanical Engineering Departments, in addition to the Physics Department within the College of Arts and Science. The High Density Electronics Center (HiDEC), established in 1992 with DARPA funds to conduct research on advanced electronic packaging technologies, enables the educators to interact within the various disciplines to achieve the set objectives of packaging in these areas. The paper will outline the mission of each area, the vision and objectives of the administration, the technical issues to be addressed, the technological challenges and barriers for the Department to face and overcome to make this vision a true reality, and the curriculum restructure. The paper will also outline how critical these strategic areas are for a national academic institution recognition and fulfillment of critical needs for our nation's global competitiveness.","PeriodicalId":410140,"journal":{"name":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Curriculum restructure to answer critical needs in packaging for energy efficiency/renewable energy systems, wireless, and mixed-signal systems areas\",\"authors\":\"W. Brown, A. Elshabini, S. Ang, J. Balda, F. Barlow, R. Coubillion, A. Malshe, R. Malstrom, A. Mantooth, T. Martin, H. Naseem, R. Jones, W. Waite, R. Brown, N. Schmitt, D. Nutter, G. Salamo, L. Schaper, W. Schmidt, R. Selvam, S. Singh, K. Olejniczak, R. Ulrich, J. Yeargan, E. Yaz, W. White\",\"doi\":\"10.1109/ECTC.2000.853338\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Electrical Engineering Department at University of Arkansas has been building considerable strength in Energy Efficiency/Renewable Energy Systems, Mixed-Signal, and Wireless Packaging areas. This effort is in coordination with critical other Departments within the College of Engineering; specifically Industrial Engineering and Mechanical Engineering Departments, in addition to the Physics Department within the College of Arts and Science. The High Density Electronics Center (HiDEC), established in 1992 with DARPA funds to conduct research on advanced electronic packaging technologies, enables the educators to interact within the various disciplines to achieve the set objectives of packaging in these areas. The paper will outline the mission of each area, the vision and objectives of the administration, the technical issues to be addressed, the technological challenges and barriers for the Department to face and overcome to make this vision a true reality, and the curriculum restructure. The paper will also outline how critical these strategic areas are for a national academic institution recognition and fulfillment of critical needs for our nation's global competitiveness.\",\"PeriodicalId\":410140,\"journal\":{\"name\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2000.853338\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2000.853338","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Curriculum restructure to answer critical needs in packaging for energy efficiency/renewable energy systems, wireless, and mixed-signal systems areas
The Electrical Engineering Department at University of Arkansas has been building considerable strength in Energy Efficiency/Renewable Energy Systems, Mixed-Signal, and Wireless Packaging areas. This effort is in coordination with critical other Departments within the College of Engineering; specifically Industrial Engineering and Mechanical Engineering Departments, in addition to the Physics Department within the College of Arts and Science. The High Density Electronics Center (HiDEC), established in 1992 with DARPA funds to conduct research on advanced electronic packaging technologies, enables the educators to interact within the various disciplines to achieve the set objectives of packaging in these areas. The paper will outline the mission of each area, the vision and objectives of the administration, the technical issues to be addressed, the technological challenges and barriers for the Department to face and overcome to make this vision a true reality, and the curriculum restructure. The paper will also outline how critical these strategic areas are for a national academic institution recognition and fulfillment of critical needs for our nation's global competitiveness.