{"title":"用DCIV法提取杂质浓度谱","authors":"Yihui Wang, C. Sah","doi":"10.1109/VTSA.2001.934475","DOIUrl":null,"url":null,"abstract":"The lineshape of the DCIV (Base Current vs Gate Voltage) characteristics is used to extract the spatial variation of the surface impurity concentration in the drain and source extension regions, the drain and source junction regions, and the basewell channel region. Examples are presented to illustrate nanometer spatial resolution of defect enhanced impurity diffusion, nitride barrier against boron penetration through thin gate oxide, and strain-induced interface traps.","PeriodicalId":388391,"journal":{"name":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Extraction of impurity concentration profiles by the DCIV method\",\"authors\":\"Yihui Wang, C. Sah\",\"doi\":\"10.1109/VTSA.2001.934475\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The lineshape of the DCIV (Base Current vs Gate Voltage) characteristics is used to extract the spatial variation of the surface impurity concentration in the drain and source extension regions, the drain and source junction regions, and the basewell channel region. Examples are presented to illustrate nanometer spatial resolution of defect enhanced impurity diffusion, nitride barrier against boron penetration through thin gate oxide, and strain-induced interface traps.\",\"PeriodicalId\":388391,\"journal\":{\"name\":\"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-04-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VTSA.2001.934475\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTSA.2001.934475","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Extraction of impurity concentration profiles by the DCIV method
The lineshape of the DCIV (Base Current vs Gate Voltage) characteristics is used to extract the spatial variation of the surface impurity concentration in the drain and source extension regions, the drain and source junction regions, and the basewell channel region. Examples are presented to illustrate nanometer spatial resolution of defect enhanced impurity diffusion, nitride barrier against boron penetration through thin gate oxide, and strain-induced interface traps.