高可靠性条件下PCBA线材腐蚀失效分析案例

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2019-07-01 DOI:10.1109/IPFA47161.2019.8984793

Jie Zheng, Ying Yang, Jianghua Shen, Lili Ma, Sheng-zong He

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引用次数: 0

摘要

无清洗工艺PCBA的断线发生在应用开始时。通过目视检查、横截面、SEM & EDS、离子色谱分析，发现焊料源侧表面离子(溴化物离子)含量高，造成了波峰焊表面导体的腐蚀和断裂，本文还对溴化物离子的来源进行了分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The Case of Failure Analysis of the PCBA Wire Corrosion under High Reliability Requirements

The wire breakage of a no-cleaning process PCBA occurs at the beginning of the application. Through visual inspection, cross-section, SEM & EDS, and ion chromatography analysis, it was found that the high content of ions (bromide ion) on the surface of the solder source side caused corrosion and fracture of the conductors of wave soldering surface, this article also analyzes the source of bromide ion.

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来源期刊

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)

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