{"title":"使用s参数测量准确和完整的频率相关传输线特性","authors":"T. Winkel","doi":"10.1109/EPEP.1999.819210","DOIUrl":null,"url":null,"abstract":"A very accurate and complete characterization of interconnects is presented. The method is based upon high-frequency S-parameter measurements of two lines of different lengths. The influence of the contact structures of the measurement probes are taken into account with the help of three additional measurements. A comparison of results obtained from measurements on a silicon substrate and from calculations is given and shows excellent agreement.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"An accurate and complete frequency dependent transmission line characterization using S-parameter measurements\",\"authors\":\"T. Winkel\",\"doi\":\"10.1109/EPEP.1999.819210\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A very accurate and complete characterization of interconnects is presented. The method is based upon high-frequency S-parameter measurements of two lines of different lengths. The influence of the contact structures of the measurement probes are taken into account with the help of three additional measurements. A comparison of results obtained from measurements on a silicon substrate and from calculations is given and shows excellent agreement.\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819210\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819210","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An accurate and complete frequency dependent transmission line characterization using S-parameter measurements
A very accurate and complete characterization of interconnects is presented. The method is based upon high-frequency S-parameter measurements of two lines of different lengths. The influence of the contact structures of the measurement probes are taken into account with the help of three additional measurements. A comparison of results obtained from measurements on a silicon substrate and from calculations is given and shows excellent agreement.