{"title":"咨询委员会主席的话","authors":"Tadao Nakamura","doi":"10.1109/CoolChips.2014.6842940","DOIUrl":null,"url":null,"abstract":"On behalf of the advisory committee of COOL Chips XVII, I extend greetings to each of the conference attendees. The productive goal of this conference is to be part of the premier/leading conference series on microprocessor architecture and technology. This rapidly growing field still regularly and aggressively produces innovative ideas and corresponding products for the cyber world around us day by day.","PeriodicalId":366328,"journal":{"name":"2014 IEEE COOL Chips XVII","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Message from the advisory committee chair\",\"authors\":\"Tadao Nakamura\",\"doi\":\"10.1109/CoolChips.2014.6842940\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"On behalf of the advisory committee of COOL Chips XVII, I extend greetings to each of the conference attendees. The productive goal of this conference is to be part of the premier/leading conference series on microprocessor architecture and technology. This rapidly growing field still regularly and aggressively produces innovative ideas and corresponding products for the cyber world around us day by day.\",\"PeriodicalId\":366328,\"journal\":{\"name\":\"2014 IEEE COOL Chips XVII\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE COOL Chips XVII\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CoolChips.2014.6842940\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE COOL Chips XVII","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CoolChips.2014.6842940","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
On behalf of the advisory committee of COOL Chips XVII, I extend greetings to each of the conference attendees. The productive goal of this conference is to be part of the premier/leading conference series on microprocessor architecture and technology. This rapidly growing field still regularly and aggressively produces innovative ideas and corresponding products for the cyber world around us day by day.