{"title":"基于温度相关特性的高温DC-DC变换器设计优化","authors":"Saikat Dey, Ayan Mallik, N. Goldsman, Z. Dilli","doi":"10.1109/APEC43599.2022.9773769","DOIUrl":null,"url":null,"abstract":"This paper demonstrates the design procedure of a wide voltage gain non-inverting buck-boost converter (NIBB) for high temperature (>150°C) application utilizing the bare die Silicon Carbide (SiC) technology. This work evaluates the ability of SiC bare dies for high temperature (>150°C) power electronics. The selection of the passive components in the power stage such as inductor and capacitors are performed by evaluating a temperature dependent characterization of their performance metrices such as permeability, inductance, leakage current and capacitance. To minimize the temperature rise of the SiC MOSFETs under the full load operation, a quantitative design optimization is performed on the inductance value while accounting for switching and conduction losses and checking for full soft-switching constraints to attain the global minima in total power loss at the switches. A 100W converter prototype is fabricated and tested that converts the input side battery voltage levels of 28V, 120V, and 160V to a configurable output voltage from 30V to 48V, used as a standard for space missions. The experimental result shows a peak conversion efficiency of 91.3% at 200°C ambient temperature. The average full load efficiency of 88.2% at maximum ambient operating temperature validates the proposed design optimization procedure and also makes the SiC bare die technology a suitable candidate for this high temperature application.","PeriodicalId":127006,"journal":{"name":"2022 IEEE Applied Power Electronics Conference and Exposition (APEC)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Temperature Dependent Characterization-based Design Optimization of a DC-DC Converter for High-Temperature Applications\",\"authors\":\"Saikat Dey, Ayan Mallik, N. Goldsman, Z. Dilli\",\"doi\":\"10.1109/APEC43599.2022.9773769\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper demonstrates the design procedure of a wide voltage gain non-inverting buck-boost converter (NIBB) for high temperature (>150°C) application utilizing the bare die Silicon Carbide (SiC) technology. This work evaluates the ability of SiC bare dies for high temperature (>150°C) power electronics. The selection of the passive components in the power stage such as inductor and capacitors are performed by evaluating a temperature dependent characterization of their performance metrices such as permeability, inductance, leakage current and capacitance. To minimize the temperature rise of the SiC MOSFETs under the full load operation, a quantitative design optimization is performed on the inductance value while accounting for switching and conduction losses and checking for full soft-switching constraints to attain the global minima in total power loss at the switches. A 100W converter prototype is fabricated and tested that converts the input side battery voltage levels of 28V, 120V, and 160V to a configurable output voltage from 30V to 48V, used as a standard for space missions. The experimental result shows a peak conversion efficiency of 91.3% at 200°C ambient temperature. The average full load efficiency of 88.2% at maximum ambient operating temperature validates the proposed design optimization procedure and also makes the SiC bare die technology a suitable candidate for this high temperature application.\",\"PeriodicalId\":127006,\"journal\":{\"name\":\"2022 IEEE Applied Power Electronics Conference and Exposition (APEC)\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-03-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE Applied Power Electronics Conference and Exposition (APEC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APEC43599.2022.9773769\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Applied Power Electronics Conference and Exposition (APEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC43599.2022.9773769","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Temperature Dependent Characterization-based Design Optimization of a DC-DC Converter for High-Temperature Applications
This paper demonstrates the design procedure of a wide voltage gain non-inverting buck-boost converter (NIBB) for high temperature (>150°C) application utilizing the bare die Silicon Carbide (SiC) technology. This work evaluates the ability of SiC bare dies for high temperature (>150°C) power electronics. The selection of the passive components in the power stage such as inductor and capacitors are performed by evaluating a temperature dependent characterization of their performance metrices such as permeability, inductance, leakage current and capacitance. To minimize the temperature rise of the SiC MOSFETs under the full load operation, a quantitative design optimization is performed on the inductance value while accounting for switching and conduction losses and checking for full soft-switching constraints to attain the global minima in total power loss at the switches. A 100W converter prototype is fabricated and tested that converts the input side battery voltage levels of 28V, 120V, and 160V to a configurable output voltage from 30V to 48V, used as a standard for space missions. The experimental result shows a peak conversion efficiency of 91.3% at 200°C ambient temperature. The average full load efficiency of 88.2% at maximum ambient operating temperature validates the proposed design optimization procedure and also makes the SiC bare die technology a suitable candidate for this high temperature application.