mpsoc的温度感知任务调度

A. Coskun, T. Simunic, K. Whisnant
{"title":"mpsoc的温度感知任务调度","authors":"A. Coskun, T. Simunic, K. Whisnant","doi":"10.1145/1266366.1266730","DOIUrl":null,"url":null,"abstract":"In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal management techniques sacrifice performance to control the thermal behavior by slowing down or turning off the processors when a critical temperature threshold is exceeded. Moreover, studies have shown that in addition to high temperatures, temporal and spatial variations in temperature impact system reliability. In this work, we explore the benefits of thermally aware task scheduling for multiprocessor systems-on-a-chip (MPSoC). We design and evaluate OS-level dynamic scheduling policies with negligible performance overhead. We show that, using simple to implement policies that make decisions based on temperature measurements, better temporal and spatial thermal profiles can be achieved in comparison to state-of-art schedulers. We also enhance reactive strategies such as dynamic thread migration with our scheduling policies. This way, hot spots and temperature variations are decreased, and the performance cost is significantly reduced","PeriodicalId":298961,"journal":{"name":"2007 Design, Automation & Test in Europe Conference & Exhibition","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"277","resultStr":"{\"title\":\"Temperature Aware Task Scheduling in MPSoCs\",\"authors\":\"A. Coskun, T. Simunic, K. Whisnant\",\"doi\":\"10.1145/1266366.1266730\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal management techniques sacrifice performance to control the thermal behavior by slowing down or turning off the processors when a critical temperature threshold is exceeded. Moreover, studies have shown that in addition to high temperatures, temporal and spatial variations in temperature impact system reliability. In this work, we explore the benefits of thermally aware task scheduling for multiprocessor systems-on-a-chip (MPSoC). We design and evaluate OS-level dynamic scheduling policies with negligible performance overhead. We show that, using simple to implement policies that make decisions based on temperature measurements, better temporal and spatial thermal profiles can be achieved in comparison to state-of-art schedulers. We also enhance reactive strategies such as dynamic thread migration with our scheduling policies. This way, hot spots and temperature variations are decreased, and the performance cost is significantly reduced\",\"PeriodicalId\":298961,\"journal\":{\"name\":\"2007 Design, Automation & Test in Europe Conference & Exhibition\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-04-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"277\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 Design, Automation & Test in Europe Conference & Exhibition\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/1266366.1266730\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 Design, Automation & Test in Europe Conference & Exhibition","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1266366.1266730","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 277

摘要

在深亚微米电路中,温度的升高在可靠性、时序、性能、冷却成本和泄漏功率方面带来了新的挑战。传统的热管理技术通过在超过临界温度阈值时减慢或关闭处理器来牺牲性能来控制热行为。此外,研究表明,除了高温之外,温度的时空变化也会影响系统的可靠性。在这项工作中,我们探讨了多处理器片上系统(MPSoC)热感知任务调度的好处。我们设计和评估操作系统级动态调度策略,性能开销可以忽略不计。我们表明,与最先进的调度器相比,使用简单的策略来实现基于温度测量的决策,可以实现更好的时空热分布。我们还通过调度策略增强了响应策略,例如动态线程迁移。这样,减少了热点和温度变化,显著降低了性能成本
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Temperature Aware Task Scheduling in MPSoCs
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal management techniques sacrifice performance to control the thermal behavior by slowing down or turning off the processors when a critical temperature threshold is exceeded. Moreover, studies have shown that in addition to high temperatures, temporal and spatial variations in temperature impact system reliability. In this work, we explore the benefits of thermally aware task scheduling for multiprocessor systems-on-a-chip (MPSoC). We design and evaluate OS-level dynamic scheduling policies with negligible performance overhead. We show that, using simple to implement policies that make decisions based on temperature measurements, better temporal and spatial thermal profiles can be achieved in comparison to state-of-art schedulers. We also enhance reactive strategies such as dynamic thread migration with our scheduling policies. This way, hot spots and temperature variations are decreased, and the performance cost is significantly reduced
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信