{"title":"非均匀多层结构的频域模型","authors":"J. Braun, Z. Žilka, Z. Berka","doi":"10.1109/SPI.2005.1500933","DOIUrl":null,"url":null,"abstract":"In this paper a sandwich multilayer structure as a model of a mixed-signal systems (digital and analog) interconnect is introduced. The method for analysis in frequency domain of such inhomogenous structure based on matrix functions is presented. The program AMVOLC for the analysis of printed circuit interconnect is described. With the described approach the more complicated structures may be analyzed as well.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"382 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"SPI proceedings: model of nonhomogenous multilayer structures in frequency domain\",\"authors\":\"J. Braun, Z. Žilka, Z. Berka\",\"doi\":\"10.1109/SPI.2005.1500933\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper a sandwich multilayer structure as a model of a mixed-signal systems (digital and analog) interconnect is introduced. The method for analysis in frequency domain of such inhomogenous structure based on matrix functions is presented. The program AMVOLC for the analysis of printed circuit interconnect is described. With the described approach the more complicated structures may be analyzed as well.\",\"PeriodicalId\":182291,\"journal\":{\"name\":\"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.\",\"volume\":\"382 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2005.1500933\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2005.1500933","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
SPI proceedings: model of nonhomogenous multilayer structures in frequency domain
In this paper a sandwich multilayer structure as a model of a mixed-signal systems (digital and analog) interconnect is introduced. The method for analysis in frequency domain of such inhomogenous structure based on matrix functions is presented. The program AMVOLC for the analysis of printed circuit interconnect is described. With the described approach the more complicated structures may be analyzed as well.
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