无线片上网络:多核芯片设计的新时代

Sujay Deb, H. Mondal
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引用次数: 9

摘要

片上网络(NoC)是一种能够在单个芯片上集成大量嵌入式核心的技术。现有的利用平面金属互连实现NoC的方法由于数据交换中使用的多跳链路产生的高延迟和显著的功耗而存在不足。为了解决这些问题,NoC中的多跳线互连可以用高带宽单跳远程无线链路代替。这为详细研究带有片上天线、合适的收发器和路由器的无线noc (WiNoCs)的设计提供了新的机会。此外,由于它是一项新兴技术,片上无线链路还需要克服与可靠集成有关的重大挑战。在本文中,我们提出了关于设计高效可靠的WiNoC体系结构的各种挑战和新兴解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Wireless network-on-chip: a new era in multi-core chip design
The Network-on-Chip (NoC) is an enabling technology to integrate large numbers of embedded cores on a single die. The existing method of implementing a NoC with planar metal interconnects is deficient due to high latency and significant power consumption arising out of multi-hop links used in data exchange. To address these problems multi-hop wire interconnects in a NoC can be replaced with high-bandwidth single-hop long-range wireless links. This opens up new opportunities for detailed investigations into the design of wireless NoCs (WiNoCs) with on-chip antennas, suitable transceivers and routers. Moreover, as it is an emerging technology, the on-chip wireless links also need to overcome significant challenges pertaining to reliable integration. In this paper we present various challenges and emerging solutions regarding the design of an efficient and reliable WiNoC architecture.
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