基于融合预测的微电子器件鉴定

M. Pecht, E. George, A. Vasan, P. Chauhan
{"title":"基于融合预测的微电子器件鉴定","authors":"M. Pecht, E. George, A. Vasan, P. Chauhan","doi":"10.1109/IPFA.2014.6898209","DOIUrl":null,"url":null,"abstract":"The rapid evolution of electronic products has resulted in numerous choices for customers. This has made for intense competition between manufacturers to reduce costs and minimize the time to market for their products. One bottle-neck in getting products to market is the qualification process, which has traditionally been time-consuming and often inadequate to prevent failures in field. In particular, in the past decade, there have been significant numbers of microelectronic devices that have passed qualification tests but failed in the field. The resulting costs of these failures have been in the billions of dollars. Thus, there is a need to develop approaches to qualification methodologies that quicken the development time but also prevent product failures in the field. This paper discusses the current state of qualification practices in the electronics industry. Then, an alternative approach, called fusion prognostics, for qualification is presented that can make the process more efficient and cost-effective. This approach involves an in-situ qualification process that incorporates a fusion of machine learning techniques and physics-of-failure based prognostics. The machine learning techniques are used to monitor the degradation behavior during testing. On the other hand, the physics-of-failure techniques identify critical failure mechanisms and the acceleration factors.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Fusion prognostics-based qualification of microelectronic devices\",\"authors\":\"M. Pecht, E. George, A. Vasan, P. Chauhan\",\"doi\":\"10.1109/IPFA.2014.6898209\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The rapid evolution of electronic products has resulted in numerous choices for customers. This has made for intense competition between manufacturers to reduce costs and minimize the time to market for their products. One bottle-neck in getting products to market is the qualification process, which has traditionally been time-consuming and often inadequate to prevent failures in field. In particular, in the past decade, there have been significant numbers of microelectronic devices that have passed qualification tests but failed in the field. The resulting costs of these failures have been in the billions of dollars. Thus, there is a need to develop approaches to qualification methodologies that quicken the development time but also prevent product failures in the field. This paper discusses the current state of qualification practices in the electronics industry. Then, an alternative approach, called fusion prognostics, for qualification is presented that can make the process more efficient and cost-effective. This approach involves an in-situ qualification process that incorporates a fusion of machine learning techniques and physics-of-failure based prognostics. The machine learning techniques are used to monitor the degradation behavior during testing. On the other hand, the physics-of-failure techniques identify critical failure mechanisms and the acceleration factors.\",\"PeriodicalId\":409316,\"journal\":{\"name\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2014.6898209\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

电子产品的快速发展给消费者带来了无数的选择。这导致了制造商之间的激烈竞争,以降低成本并最大限度地缩短产品上市时间。将产品推向市场的一个瓶颈是认证过程,这一过程传统上很耗时,而且往往不足以防止现场出现故障。特别是在过去十年中,有相当数量的微电子设备通过了资格测试,但在该领域失败了。这些失败造成的损失高达数十亿美元。因此,有必要开发认证方法,以加快开发时间,同时也防止产品在该领域的失败。本文讨论了电子行业资格认证实践的现状。然后,提出了一种替代方法,称为融合预后,用于鉴定,可以使过程更有效和更具成本效益。这种方法包括一个现场鉴定过程,该过程融合了机器学习技术和基于故障物理的预测。机器学习技术用于监测测试过程中的退化行为。另一方面,失效物理技术确定了关键失效机制和加速因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fusion prognostics-based qualification of microelectronic devices
The rapid evolution of electronic products has resulted in numerous choices for customers. This has made for intense competition between manufacturers to reduce costs and minimize the time to market for their products. One bottle-neck in getting products to market is the qualification process, which has traditionally been time-consuming and often inadequate to prevent failures in field. In particular, in the past decade, there have been significant numbers of microelectronic devices that have passed qualification tests but failed in the field. The resulting costs of these failures have been in the billions of dollars. Thus, there is a need to develop approaches to qualification methodologies that quicken the development time but also prevent product failures in the field. This paper discusses the current state of qualification practices in the electronics industry. Then, an alternative approach, called fusion prognostics, for qualification is presented that can make the process more efficient and cost-effective. This approach involves an in-situ qualification process that incorporates a fusion of machine learning techniques and physics-of-failure based prognostics. The machine learning techniques are used to monitor the degradation behavior during testing. On the other hand, the physics-of-failure techniques identify critical failure mechanisms and the acceleration factors.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信