{"title":"一种高密度逻辑CMOS工艺兼容的非易失性存储器,用于sub-28nm技术","authors":"R. Shen, Meng-Yi Wu, Hsin-Ming Chen, C. Lu","doi":"10.1109/VLSIT.2014.6894353","DOIUrl":null,"url":null,"abstract":"Various product applications bring up with increasing demands of logic NVM IP in advanced technology nodes. Encryption, security, functionality, and identification setting become indispensable in communication and high-end consumer electronics. A non-volatile memory cell, using anti-fuse programming mechanism to achieve high density and excellent data storage lifetime, is proposed. The unique cell design and operation scheme realize low programming-inhibit leakage current, fast program speed, and robust data retention. The memory macro is successfully demonstrated for one-time and multi-time programming applications with its full compatibility to sub-28nm and FinFET processes.","PeriodicalId":105807,"journal":{"name":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"A high-density logic CMOS process compatible non-volatile memory for sub-28nm technologies\",\"authors\":\"R. Shen, Meng-Yi Wu, Hsin-Ming Chen, C. Lu\",\"doi\":\"10.1109/VLSIT.2014.6894353\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Various product applications bring up with increasing demands of logic NVM IP in advanced technology nodes. Encryption, security, functionality, and identification setting become indispensable in communication and high-end consumer electronics. A non-volatile memory cell, using anti-fuse programming mechanism to achieve high density and excellent data storage lifetime, is proposed. The unique cell design and operation scheme realize low programming-inhibit leakage current, fast program speed, and robust data retention. The memory macro is successfully demonstrated for one-time and multi-time programming applications with its full compatibility to sub-28nm and FinFET processes.\",\"PeriodicalId\":105807,\"journal\":{\"name\":\"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-06-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSIT.2014.6894353\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2014.6894353","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A high-density logic CMOS process compatible non-volatile memory for sub-28nm technologies
Various product applications bring up with increasing demands of logic NVM IP in advanced technology nodes. Encryption, security, functionality, and identification setting become indispensable in communication and high-end consumer electronics. A non-volatile memory cell, using anti-fuse programming mechanism to achieve high density and excellent data storage lifetime, is proposed. The unique cell design and operation scheme realize low programming-inhibit leakage current, fast program speed, and robust data retention. The memory macro is successfully demonstrated for one-time and multi-time programming applications with its full compatibility to sub-28nm and FinFET processes.