[110]取向Si衬底上的超低导通电阻p沟道横向DMOS

K. Throngnumchai
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引用次数: 0

摘要

本文提出了一种p沟道横向DMOS (LDMOS),通过使用(110)取向Si衬底来提高电阻。这种LDMOS的特定导通电阻被认为是迄今为止报道的p沟道功率mosfet中最低的。尽管p沟道功率mosfet的导通电阻Ron比具有相同芯片尺寸的n沟道器件的导通电阻Ron高约三倍,但它仍然广泛应用于诸如高侧开关和互补电路等应用中。虽然需要降低这些器件的Ron值,但传统的(100)基板不具有适合此目的的取向,因为它们的空穴迁移率低于(110)基板。在本研究中,我们在(100)和(110)衬底上制备了p通道LDMOS,并比较了它们的导通电阻。这两种类型的样品都是用双金属化和类似于参考文献1中描述的六角形图案制造的。用于制备两种样品类型的n型衬底的电阻率保持恒定
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Uitra-low on-resistance p-channel lateral DMOS fabricated on [110]-oriented Si substrate
This paper presents a p-channel lateral DMOS (LDMOS) featuring improved onresistance through the use of a (1 10)-oriented Si substrate. The specific on-resistance of this LDMOS is believed to be the lowest among p-channel power MOSFETs reported to date. P-channel power MOSFETs are still widely used in such applications as high-side switching and complementary circuits even though their on-resistance, Ron, is about three times higher than that of n-channel devices having the same chip-size. While there is a need to reduce the Ron value of these devices, conventional (100)-substrates do not have a suitable orientation for this purpose because their hole mobility is lower than that of (1 10)-substrates. In this study, we fabricated p-channel LDMOS on both (100)and (1 10)-substrates and compared their on-resistance. Both types of samples were fabricated using double metallization and a hexagonal pattern similar to that described in ref. 1. The resistivity of the n-type substrates used in fabricating both sample types was kept constant at
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