{"title":"[110]取向Si衬底上的超低导通电阻p沟道横向DMOS","authors":"K. Throngnumchai","doi":"10.1109/DRC.1993.1009608","DOIUrl":null,"url":null,"abstract":"This paper presents a p-channel lateral DMOS (LDMOS) featuring improved onresistance through the use of a (1 10)-oriented Si substrate. The specific on-resistance of this LDMOS is believed to be the lowest among p-channel power MOSFETs reported to date. P-channel power MOSFETs are still widely used in such applications as high-side switching and complementary circuits even though their on-resistance, Ron, is about three times higher than that of n-channel devices having the same chip-size. While there is a need to reduce the Ron value of these devices, conventional (100)-substrates do not have a suitable orientation for this purpose because their hole mobility is lower than that of (1 10)-substrates. In this study, we fabricated p-channel LDMOS on both (100)and (1 10)-substrates and compared their on-resistance. Both types of samples were fabricated using double metallization and a hexagonal pattern similar to that described in ref. 1. The resistivity of the n-type substrates used in fabricating both sample types was kept constant at","PeriodicalId":310841,"journal":{"name":"51st Annual Device Research Conference","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Uitra-low on-resistance p-channel lateral DMOS fabricated on [110]-oriented Si substrate\",\"authors\":\"K. Throngnumchai\",\"doi\":\"10.1109/DRC.1993.1009608\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a p-channel lateral DMOS (LDMOS) featuring improved onresistance through the use of a (1 10)-oriented Si substrate. The specific on-resistance of this LDMOS is believed to be the lowest among p-channel power MOSFETs reported to date. P-channel power MOSFETs are still widely used in such applications as high-side switching and complementary circuits even though their on-resistance, Ron, is about three times higher than that of n-channel devices having the same chip-size. While there is a need to reduce the Ron value of these devices, conventional (100)-substrates do not have a suitable orientation for this purpose because their hole mobility is lower than that of (1 10)-substrates. In this study, we fabricated p-channel LDMOS on both (100)and (1 10)-substrates and compared their on-resistance. Both types of samples were fabricated using double metallization and a hexagonal pattern similar to that described in ref. 1. The resistivity of the n-type substrates used in fabricating both sample types was kept constant at\",\"PeriodicalId\":310841,\"journal\":{\"name\":\"51st Annual Device Research Conference\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"51st Annual Device Research Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DRC.1993.1009608\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"51st Annual Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DRC.1993.1009608","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Uitra-low on-resistance p-channel lateral DMOS fabricated on [110]-oriented Si substrate
This paper presents a p-channel lateral DMOS (LDMOS) featuring improved onresistance through the use of a (1 10)-oriented Si substrate. The specific on-resistance of this LDMOS is believed to be the lowest among p-channel power MOSFETs reported to date. P-channel power MOSFETs are still widely used in such applications as high-side switching and complementary circuits even though their on-resistance, Ron, is about three times higher than that of n-channel devices having the same chip-size. While there is a need to reduce the Ron value of these devices, conventional (100)-substrates do not have a suitable orientation for this purpose because their hole mobility is lower than that of (1 10)-substrates. In this study, we fabricated p-channel LDMOS on both (100)and (1 10)-substrates and compared their on-resistance. Both types of samples were fabricated using double metallization and a hexagonal pattern similar to that described in ref. 1. The resistivity of the n-type substrates used in fabricating both sample types was kept constant at