BGA除湿技术的初步研究

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298758

Zhao Zhi-ping

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引用次数: 0

摘要

BGA非常容易受到湿度的影响，它应该在开箱后8小时内使用，但这在实际生产中几乎是不可能的。通过对加湿后的BGA进行预处理实验，我们得出结论，对于开箱后在空气中停留超过8小时的BGA，必须在烤箱中以125/spl℃的温度烘烤40小时进行除湿。

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A preliminary research on the dehumidify technology of BGA

A BGA is very susceptible to humidity and it should be used within eight hours of unpacking, but this is almost impossible in practical production. After carrying out a pre-dealing experiment on humidified BGAs, we come to the conclusion that a BGA which has been unpacked and remained in the air for more than eight hours must be dehumidified by means of being baked for 40 hours at a temperature of 125/spl deg/C in an oven.

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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