真空脉冲电压条件下Cu-Cr电极表面的改善

H. Kojima, Hideaki Yasukawa, R. Nishimura, H. Okubo, H. Sato, H. Saito, Y. Noda
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引用次数: 3

摘要

随着真空因其高绝缘性能和环境友好性而受到人们的关注,真空断路器有望向更高电压水平发展。本文讨论了真空脉冲电压施加过程中Cu-Cr电极表面状态与调理机理之间的关系。实验结果表明,阴极表面沉积层是由负极材料在脉冲电压作用下形成的。我们最终明确并得出结论,在脉冲电压的作用下,阴极表面的特性正在向阳极材料的特性转变,而阳极材料可以决定调理过程的最终状态。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Improvement of Cu-Cr electrode surface under impulse voltage conditioning in vacuum
As vacuum attracts attention from a viewpoint of high insulation performance and environmental-friendliness, vacuum circuit breakers (VCBs) are expected to develop into higher voltage level. In this paper, we discuss the relations between the surface state and the conditioning mechanism of Cu-Cr electrode during impulse voltage application process in vacuum. The experimental results showed that the deposited layer at the cathode surface was formed by the anode material due to the impulse voltage application process. We finally clarified and concluded that under impulse voltage application process, characteristics of the cathode surface are changing to those of the anode material, and anode material could determine the final states of conditioning process.
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