Bonding with Zn-based solders through self-propagating exothermic reaction to enable high-temperature electronics packaging

With the growing interest in Wide Band Gap (WBG) devices that can operate under higher temperatures (≥250°C), there is an imperative demand to develop advanced bonding processes and materials to meet the reliability requirements. In the current work, self-propagating exothermic reaction (SPER) has been applied to assist the bonding based on Zn-based solders. With the Zn-based solder precoated on various electronic components, bonding is achieved at the Ni/Al nanofoil/solder interface experimentally. The simulation results show that the maximum melting thickness of solder decreased with the increase of substrate thickness. When Si die was applied, nanofoil exhibited the best bonding strength with solder. Preheating is beneficial to expand the melting thickness of solder. The experimental results confirmed the predicted results from the simulation, which can be potentially used for high-temperature electronics packaging.