金/多孔硅薄膜的电输运和阻抗分析

F. Fonthal, C. Goyes, A. Rodroguez
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引用次数: 2

摘要

为了获得基于PS/p-Si结构的电子器件,我们研究了在p型硅(p-Si)衬底上电化学刻蚀制备的多孔硅(PS)层的交流电导率和热电行为。首先是在多孔层上获得良好的电接触;为此,对多个Au/PS/Au结进行了电学表征,以了解其在多孔表面的输运机制和多孔性能的温度依赖性,以及PS/p-Si热敏电阻器件的电阻-温度特性。最后,我们得到了交流电导率的模和相位;提出了一种等效电路来拟合不同样品的实验频率响应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical Transport and Impedance Analysis of Au/Porous Silicon Thin Films
In order to obtain electronic devices based on PS/p-Si structure, we present a study the AC conductivity and Thermo-electrical behavior of Porous Silicon (PS) layers prepared by electrochemical etching in p-type silicon (p-Si) <100>substrates. The beginning is obtaining good electrical contacts on porous layer; for this reason, several Au/PS/Au junctions were electrically characterized to understand the transport mechanisms in porous surface and the temperature dependence in the porous properties studied, also the resistance-temperature characteristic of PS/p-Si thermistor device. Finally, we obtained the AC conductivity in modulo and phase; an electrical equivalent circuit was proposed to fit the experimental frequency response of the different samples.
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