{"title":"在BEOL层中实现NEM继电器的设计优化","authors":"U. Sikder, T. Liu","doi":"10.1109/S3S.2017.8309249","DOIUrl":null,"url":null,"abstract":"This work discusses design considerations for a nano-electro-mechanical (NEM) relay implemented with a standard CMOS fabrication process utilizing the back-end-of-line (BEOL) metal layers. The quasi-static and dynamic performances of the relay are simulated using Coventor MEMS+. Various design trade-offs are discussed. A design optimization scheme for minimizing the energy-delay product is presented.","PeriodicalId":333587,"journal":{"name":"2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)","volume":"110 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Design optimization for NEM relays implemented in BEOL layers\",\"authors\":\"U. Sikder, T. Liu\",\"doi\":\"10.1109/S3S.2017.8309249\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work discusses design considerations for a nano-electro-mechanical (NEM) relay implemented with a standard CMOS fabrication process utilizing the back-end-of-line (BEOL) metal layers. The quasi-static and dynamic performances of the relay are simulated using Coventor MEMS+. Various design trade-offs are discussed. A design optimization scheme for minimizing the energy-delay product is presented.\",\"PeriodicalId\":333587,\"journal\":{\"name\":\"2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)\",\"volume\":\"110 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/S3S.2017.8309249\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/S3S.2017.8309249","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design optimization for NEM relays implemented in BEOL layers
This work discusses design considerations for a nano-electro-mechanical (NEM) relay implemented with a standard CMOS fabrication process utilizing the back-end-of-line (BEOL) metal layers. The quasi-static and dynamic performances of the relay are simulated using Coventor MEMS+. Various design trade-offs are discussed. A design optimization scheme for minimizing the energy-delay product is presented.