柔性板上球触点多芯片微模块无框设计的特点

2013 IEEE XXXIII International Scientific Conference Electronics and Nanotechnology (ELNANO) Pub Date : 2013-04-16 DOI:10.1109/ELNANO.2013.6552038

D. Vertyanov, K. S. Tikhonov, S. Timoshenkov, V. Petrov, G. Blinov

{"title":"柔性板上球触点多芯片微模块无框设计的特点","authors":"D. Vertyanov, K. S. Tikhonov, S. Timoshenkov, V. Petrov, G. Blinov","doi":"10.1109/ELNANO.2013.6552038","DOIUrl":null,"url":null,"abstract":"New design and technological solution of three-dimensional multi-chip modules has been considered. Installation of bare chips on a flexible board has been done by printed circuit board assembly and external module contacts have performed in the matrix ball pins form. Test program was conducted in order to quantify the limits of the process. Application of flip-chip process to a wide range of customers particularly for 3D packaging has been discussed.","PeriodicalId":443634,"journal":{"name":"2013 IEEE XXXIII International Scientific Conference Electronics and Nanotechnology (ELNANO)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Peculiarities of multichip micro module frameless design with ball contacts on the flexible board\",\"authors\":\"D. Vertyanov, K. S. Tikhonov, S. Timoshenkov, V. Petrov, G. Blinov\",\"doi\":\"10.1109/ELNANO.2013.6552038\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"New design and technological solution of three-dimensional multi-chip modules has been considered. Installation of bare chips on a flexible board has been done by printed circuit board assembly and external module contacts have performed in the matrix ball pins form. Test program was conducted in order to quantify the limits of the process. Application of flip-chip process to a wide range of customers particularly for 3D packaging has been discussed.\",\"PeriodicalId\":443634,\"journal\":{\"name\":\"2013 IEEE XXXIII International Scientific Conference Electronics and Nanotechnology (ELNANO)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-04-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE XXXIII International Scientific Conference Electronics and Nanotechnology (ELNANO)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ELNANO.2013.6552038\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE XXXIII International Scientific Conference Electronics and Nanotechnology (ELNANO)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ELNANO.2013.6552038","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

考虑了三维多芯片模块的新设计和技术解决方案。裸芯片在柔性板上的安装已经通过印刷电路板组装完成，外部模块触点以矩阵球销形式进行。进行测试程序是为了量化该过程的限制。讨论了倒装芯片工艺在广泛客户中的应用，特别是3D封装。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Peculiarities of multichip micro module frameless design with ball contacts on the flexible board

New design and technological solution of three-dimensional multi-chip modules has been considered. Installation of bare chips on a flexible board has been done by printed circuit board assembly and external module contacts have performed in the matrix ball pins form. Test program was conducted in order to quantify the limits of the process. Application of flip-chip process to a wide range of customers particularly for 3D packaging has been discussed.

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2013 IEEE XXXIII International Scientific Conference Electronics and Nanotechnology (ELNANO)

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