面向后“摩尔时代”的半导体器件和计算机架构的和谐创新

Y. Hayashi
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引用次数: 0

摘要

由于严格的物理方向限制,根据“摩尔定律”对半导体器件进行简单的二维缩放将无法很好地提高性能和功率效率。然而,系统集成可能会继续通过单片片上集成或异质片外堆栈的3D结构演变而进一步发展。新架构和新功能材料的加速实现将是关键因素,特别是对于ΑΙ-based智能应用程序更有效地执行机器学习。刚刚,我们在JSAP中成立了SDRJ(日本系统设备路线图委员会,https://www.sdrj.jp/),并与IEEE IRDS(设备和系统国际路线图,http://irds.ieee.org/)合作,讨论了面向2030年的国际路线图。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Harmonie innovatios in semiconductor devices and computer architectures toward post “Moore-era”
Simple 2D scaling of semiconductor devices by “Moore's law” will not work well soon to improve the performances and power efficiencies due to tight physical directional limits. System integrations, however, might continue to advance further by 3D structural evolutions either in monolithic on-chip integrations or heterogeneous off-chip stacks. Accelerated implementations of new architectures and new functional materials would be key factors, especially to execute machine learnings more efficiently for ΑΙ-based smart applications. Just now, we have established SDRJ (The System Device Roadmap Committee of Japan, https://www.sdrj.jp/) in JSAP collaborated with IEEE IRDS (International Roadmap for Devices and Systems, http://irds.ieee.org/) to discuss the roadmaps internationally toward the year of 2030.
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