Y. Iizuka, N. Nashida, M. Horio, Y. Nakamura, Y. Ikeda
{"title":"具有SiC器件新功能的电源模块","authors":"Y. Iizuka, N. Nashida, M. Horio, Y. Nakamura, Y. Ikeda","doi":"10.1109/ISEIM.2011.6826395","DOIUrl":null,"url":null,"abstract":"A newly developed structure package has been investigated. It has new features, multi-pin attached interconnections and epoxy encapsulation. The pin interconnection provide large current capability for the power module. Due to the epoxy encapsulation, FEA and power-cycling test proved their superior characteristics of reliability. It has a both features for high-density packaging and high reliability, to realize large current capabilities and high temperature operation, as one of the potential candidates to next generation power module with SiC devices.","PeriodicalId":360527,"journal":{"name":"Proceedings of 2011 International Symposium on Electrical Insulating Materials","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Power module with new features for SiC devices\",\"authors\":\"Y. Iizuka, N. Nashida, M. Horio, Y. Nakamura, Y. Ikeda\",\"doi\":\"10.1109/ISEIM.2011.6826395\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A newly developed structure package has been investigated. It has new features, multi-pin attached interconnections and epoxy encapsulation. The pin interconnection provide large current capability for the power module. Due to the epoxy encapsulation, FEA and power-cycling test proved their superior characteristics of reliability. It has a both features for high-density packaging and high reliability, to realize large current capabilities and high temperature operation, as one of the potential candidates to next generation power module with SiC devices.\",\"PeriodicalId\":360527,\"journal\":{\"name\":\"Proceedings of 2011 International Symposium on Electrical Insulating Materials\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 2011 International Symposium on Electrical Insulating Materials\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEIM.2011.6826395\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 2011 International Symposium on Electrical Insulating Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEIM.2011.6826395","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A newly developed structure package has been investigated. It has new features, multi-pin attached interconnections and epoxy encapsulation. The pin interconnection provide large current capability for the power module. Due to the epoxy encapsulation, FEA and power-cycling test proved their superior characteristics of reliability. It has a both features for high-density packaging and high reliability, to realize large current capabilities and high temperature operation, as one of the potential candidates to next generation power module with SiC devices.
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