全栅极覆盖无结FinFET的射频分析以提高性能

Aman Tyagi, Gaurav Mangal, R. Chaujar
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引用次数: 0

摘要

本文分析了采用高k介电层作为栅极氧化物的全栅极覆盖无结FinFET在两个栅极长度(20nm和40nm)下的各种射频性能,并与传统FinFET进行了比较。仿真结果表明,对于较小的20nm器件,截止频率(fT)提高了约20%,最大振荡频率(fmax)也提高了5倍以上。其他射频参数,如纳米器件的增益频率积(GFP)和跨导频率积(TFP),也比传统器件显示出相当大的增量。增益跨导频率积(GTFP)也提高了2倍以上。所有这些参数使该器件成为射频应用的有吸引力的候选者。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
RF Analysis of a Fully Gate Covered Junctionless FinFET for Improved Performance
This work is an analysis of various RF performance figure of merits of a fully gate-covered Junctionless FinFET at two gate lengths (20nm and 40nm) with a high-k dielectric layer as gate oxide and is compared a conventional FinFET. The simulation results exhibit great performance increment for the smaller 20nm device terms of cutoff frequency(fT) which shows about 20% increase, the maximum oscillation frequency (fmax) which also amplified by more than five times. Other RF parameters such as Gain Frequency Product (GFP) and Transconductance Frequency Product (TFP) for the nm device, also exhibited a considerable increment over the conventional device. Gain transconductance frequency Product (GTFP) was also observed to be enhanced by more than 2 times. All these parameters make the device attractive candidate for RF applications.
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