采用高级开关级模型的纳米技术组合逻辑软误差注入

Prabhleen K. Kalkat, R. Sedaghat, Jalal Mohammad Chikhe, Reza Javaheri
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引用次数: 2

摘要

由于技术的缩放,现代数字系统越来越容易出现由CMOS逻辑器件的辐射冲击引起的单事件瞬态(set)。这导致需要更好的软错误检测方法,以提高纳米技术中逻辑电路的可靠性。目前的软误差检测技术假定软误差是由于电压脉冲改变晶体管节点的逻辑状态而产生的。采用一种新颖的软误差检测概念,假设电压波动小于逻辑阈值最终会导致软误差。设计了先进的开关级模型,模拟晶体管级电路的重要特性,如双向信号流、驱动强度变化和节点电容,并使用verilog驱动强度来模拟不同的电压值。由此产生的开关级模型消除了与最先进的晶体管级模拟器相关的复杂性,同时实现了所需的精度和更快的模拟。本文的目的是解释这些基于强度的开关模型中使用的各种参数,以便找到一种将瞬态注入复杂逻辑电路的有效方法。该方法已经通过创建模拟环境进行了实验评估,该环境允许在开关级电路的内部节点进行瞬态注入,并向ISCAS'85基准注入大范围的输入测试向量。仿真结果表明,与晶体管栅极注入相比,开关级电路漏极的瞬态注入在精度方面有更好的结果,并且可以防止软错误率计算的高估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Soft error injection using advanced switch-level models for combinational logic in nanometer technologies
Due to technology scaling, modern digital systems are becoming more prone to single-event transients (SETs) caused by radiation strikes in CMOS logic devices. This has led to the need for better soft error detection methods in order to increase the reliability of logic circuits in nanometer technologies. Present day soft error detection techniques assume that soft errors occur due to voltage pulses which change the logic state of a transistor node. A novel soft error detection concept is used, assuming that voltage fluctuations smaller than logic threshold can eventually result in soft errors. Advanced switch-level models were designed which mimic important characteristics of transistor-level circuits like bidirectional signal flow, driving strength variations and node capacitances and use verilog driving strengths to model different voltage values. The resulting switch-level models eliminate the complexity associated with state-of-art transistor level simulators while achieving desired amount of accuracy and faster simulation. The aim of this paper is to interpret various parameters used in these strength-based switch models in order to find an efficient way of injecting transients into complex logic circuits. The approach has been evaluated experimentally by creating a simulation environment which allows transient injection at internal nodes of switch-level circuits and injecting a wide range of input test vectors to ISCAS'85 benchmarks. The simulation results show that transient injection at drains of switch-level circuits gives better results in terms of accuracy and prevents over-estimation of soft error rate calculations as compared to injection at gates of transistors.
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