用于存储器应用的高热稳定性晶体IGZO晶体管的演示

Whayoung Kim, Jaehyeong Kim, D. Ko, Jun-Hwe Cha, Gyeongcheol Park, Y. Ahn, Jong-Young Lee, Minchul Sung, Hyejung Choi, S. Ryu, Seiyon Kim, Myung-Hee Na, Seonyong Cha
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引用次数: 1

摘要

高度有序结晶InGaZnO (C - igzo) tft已在550°C以上的后续工艺中得到证明,与存储应用兼容。值得注意的是,c-IGZO对高温和含氢工艺具有较强的免疫力,而非晶态IGZO (a-IGZO)则会发生团聚。与a- igzo TFTs相比,本研究优化工艺的c-IGZO TFTs具有更高的导通电流($\ mathm {I}_{\ mathm {o}}\ mathm {n}}$),且$\ mathm {V}_{\ mathm {t}\ mathm {h}}$为-1 V, $\ mathm {I}_{\ mathm {off}}$为$1.82\乘以10^{-18}$ a /$\mu$m。此外,在a-IGZO上实现了短通道裕度和$\ mathm {V}_{\ mathm {th}}$稳定性的显著增强。与a-IGZO TFT在$\ mathm {T}_{\ mathm {ox}}$ 100 Å相比,采用薄栅极氧化物(50 Å)实现了器件性能的提高,如s.s $\times$ 0.41, DIBL $\times$ 0.18, $\ mathm {I}_{\ mathm {on}}$× 76.5。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Demonstration of crystalline IGZO transistor with high thermal stability for memory applications
Highly ordered crystalline InGaZnO (c-IGZO) TFTs have been demonstrated in subsequent processes above 550 °C compatible with memory applications. Notably, c-IGZO featured strong immunity to high temperature and hydrogen-containing processes unlike amorphous IGZO (a-IGZO) where agglomeration occurs. The c-IGZO TFTs with optimized process in this study show a higher on-current ($\mathrm{I}_{\mathrm{o}\mathrm{n}}$) at a similar $\mathrm{V}_{\mathrm{t}\mathrm{h}}$ of −1 V, and $\mathrm{I}_{\mathrm{off}}$ of $1.82\times 10^{-18}$ A/$\mu$m compared with a-IGZO TFTs. In addition, striking enhancement in the short channel margin and $\mathrm{V}_{\mathrm{th}}$ stability over a-IGZO was achieved. With thin gate-oxide (50 Å), the improved device performance was realized such as S.S. $\times$ 0.41, DIBL $\times$ 0.18, and $\mathrm{I}_{\mathrm{on}}$× 76.5 compared with a-IGZO TFT at $\mathrm{T}_{\mathrm{ox}}$ 100 Å.
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