失效分析概述及其新挑战

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2009-07-06 DOI:10.1109/IPFA.2009.5232690

Susan X. Li

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引用次数: 4

摘要

失效分析是解决设计、工艺、产品和客户应用问题的关键步骤。故障分析人员需要有强大而广泛的技术背景以及独特的个性才能在这一领域取得成功。故障分析流程包含8个基本步骤，应遵循这些步骤，以确保日常分析工作的质量。三个案例研究演示了如何使用8步FA流程来解决实际生活中的问题。随着先进产品中的新技术、器件材料和架构的出现，为了在未来几年成功地支持失效分析需求，需要迎接新的挑战。

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Failure analysis overview and its new challenges

Failure analysis is a critical step for solving design, process, product and customer application issues. Failure analysts need to have strong and broad technical background as well as unique personality to be successful in this field. Failure analysis flow contains 8 basic steps, and should be followed to ensure the quality of the daily analysis work. Three case studies were demonstrated on how to use the 8-step FA flow to solve real life problems. With new technology, device materials and architecture in advanced products, new challenges need to be met in order to successfully support the failure analysis needs in the coming years.

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2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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