平行板槽耦合器的二维频域传输线矩阵建模方法

Electrical Performance of Electronic Packaging - 2004 Pub Date : 2004-10-25 DOI:10.1109/EPEP.2004.1407541

R. Ito

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引用次数: 9

摘要

采用二维频域传输线矩阵(2D- tlm)方法，分析了一种用于波导间耦合的缝隙耦合器。平行板波导间槽耦合的2D-TLM通用模型可用于设计先进的低成本毫米波封装。对通孔波导耦合器进行了建模，并与实测结果进行了对比验证。

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Parallel plate slot coupler modeling using two dimensional frequency domain transmission line matrix method

A slot coupler for coupling between via-defined waveguides is analyzed using the 2D frequency domain transmission line matrix (2D-TLM) method. The general 2D-TLM model for a slot coupling between parallel plate waveguides is useful in the design of advanced low cost millimeter-wave packaging. The via waveguide coupler is modeled and the model verified by comparison to measurement.

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Electrical Performance of Electronic Packaging - 2004

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