射频和高性能模拟应用的铸造技术

Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 2014-04-28 DOI:10.1109/VLSI-TSA.2014.6839697

P. Hurwitz, S. Chaudhry, E. Preisler, R. Kanawati, M. Racanelli

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引用次数: 4

摘要

服务于射频/混合信号和高性能模拟(HPA)市场的硅代工技术的要求与主要用于数字设计的要求非常不同。RF / HPA应用需要在模块化平台中具有丰富的功能，并具有精确的RF模型，以便在要求苛刻的应用中成功实现首通设计，强调速度，电压和噪声要求。在本文中，我们介绍了这些技术的例子，重点关注最近特别感兴趣的两个领域:用于无线手机前端模块的硅技术和用于高速网络和毫米波无线应用的高速SiGe BiCMOS技术。

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Foundry technology for RF and high performance analog applications

The requirements for silicon foundry technology serving the RF / mixed signal and high performance analog (HPA) market are very different from those intended for mostly digital designs. RF / HPA applications require a rich set of features in a modular platform with accurate RF models for first-pass design success in demanding applications that stress speed, voltage and noise requirements. In this paper we present examples of such technologies focusing on two areas of particular recent interest: silicon technology for the front-end module of wireless handsets and high-speed SiGe BiCMOS technology serving high-speed networks and mmWave wireless applications.

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Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)

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