陷阱对多晶硅体字行堆叠nand快闪存储器暂态位线电流行为的影响

Ho-Jung Kang, M. Jeong, S. Joe, Jihyun Seo, Sung-Kye Park, S. Jin, Byung-Gook Park, Jong-Ho Lee
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引用次数: 18

摘要

我们在具有多晶硅体的3-D堆叠NAND闪存中,对两个不同的单元施加预偏置(Vpre)后,表征了读取过程中瞬态位线电流(IBL)的行为。根据阻挡介质中电荷捕获的优势或隧道氧化物与多晶硅体之间的界面,观察到相反的行为。为了找出原因,我们系统地分析了两个陷阱位点的电荷捕获和发射,通过研究在不同的Vpres和快速脉冲I-Vs读取过程中的瞬态IBL行为。提取与颗粒大小相关的载流子寿命和陷阱密度,以证实不同细胞垂直位置的陷阱密度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of traps on transient bit-line current behavior in word-line stacked nand flash memory with poly-Si body
We characterized the behavior of transient bit-line current (IBL) during reading after giving a pre-bias (Vpre) to two different cells in 3-D stacked NAND flash memory having poly-Si body. Depending on the dominance of charge trapping in blocking dielectric or the interface between the tunneling oxide and the poly-Si body, opposite behavior was observed. To identify the cause, we systematically analyzed the capture and emission of charges in two trap sites by investigating transient IBL behaviors during reading with various Vpres and fast & pulsed I-Vs. The carrier life time and trap density associated with grain size were extracted to substantiate different trap density with the vertical position of cells.
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