T. Erlbacher, H. Schwarzmann, F. Krach, A. Bauer, S. Berberich, I. Kasko, L. Frey
{"title":"mos电源模块中单片rc缓冲器的可靠性研究","authors":"T. Erlbacher, H. Schwarzmann, F. Krach, A. Bauer, S. Berberich, I. Kasko, L. Frey","doi":"10.1109/ESTC.2014.6962794","DOIUrl":null,"url":null,"abstract":"The reliability of monolithic integrated 200 V RC-snubbers in silicon is investigated both on wafer and module level. The wafer level measurements indicate that the capacitor dielectric is capable of repetitively withstanding 200 V pulses with a continuous use voltage of 150 V for 46 years with a failure rate of 1 ppm. Potentially early failing devices can be identified on wafer level by a screening test. The RC-snubbers exhibit excellent stability to high temperature and high humidity high temperature based stress tests and to thermal cycling. This makes these devices a promising alternative to discrete surface mounted devices in RC snubber applications for modules in power electronic applications.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Reliability of monolithic RC-snubbers in MOS-based power modules\",\"authors\":\"T. Erlbacher, H. Schwarzmann, F. Krach, A. Bauer, S. Berberich, I. Kasko, L. Frey\",\"doi\":\"10.1109/ESTC.2014.6962794\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The reliability of monolithic integrated 200 V RC-snubbers in silicon is investigated both on wafer and module level. The wafer level measurements indicate that the capacitor dielectric is capable of repetitively withstanding 200 V pulses with a continuous use voltage of 150 V for 46 years with a failure rate of 1 ppm. Potentially early failing devices can be identified on wafer level by a screening test. The RC-snubbers exhibit excellent stability to high temperature and high humidity high temperature based stress tests and to thermal cycling. This makes these devices a promising alternative to discrete surface mounted devices in RC snubber applications for modules in power electronic applications.\",\"PeriodicalId\":299981,\"journal\":{\"name\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2014.6962794\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2014.6962794","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability of monolithic RC-snubbers in MOS-based power modules
The reliability of monolithic integrated 200 V RC-snubbers in silicon is investigated both on wafer and module level. The wafer level measurements indicate that the capacitor dielectric is capable of repetitively withstanding 200 V pulses with a continuous use voltage of 150 V for 46 years with a failure rate of 1 ppm. Potentially early failing devices can be identified on wafer level by a screening test. The RC-snubbers exhibit excellent stability to high temperature and high humidity high temperature based stress tests and to thermal cycling. This makes these devices a promising alternative to discrete surface mounted devices in RC snubber applications for modules in power electronic applications.