80 nm-200 nm栅极长度Al/sub 0.25/GaAs/GaAs/Al/sub 0.25/GaAs、Al/sub 0.3/GaAs/In/sub 0.15/GaAs/GaAs和In/sub 0.52/AlAs/In/sub 0.65/GaAs/InP HEMTs的比较

I. Thayne, M. Holland, Y. Chen, W. Li, A. Paulsen, S. Beaumont, P. Bhattacharya
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引用次数: 7

摘要

本文比较分析了在具有不同二维电子气输运特性的三种材料结构上制备的80 ~ 200nm栅极长高电子迁移率晶体管(hemt)的高频性能。伪晶InGaAs/InP器件通道中载流子的有效速度较高,使得器件栅极长度为80 nm, f/sub /s为275 GHz。发现器件输出电阻与材料有很强的相关性。在最短栅极长度下,器件f/sub max/主要受到栅极电阻的限制。此外,栅极漏极电容对栅极总电容的贡献和输出电阻的大小对f/sub max/有显著影响
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparison of 80 nm-200 nm gate length Al/sub 0.25/GaAs/GaAs/Al/sub 0.25/GaAs, Al/sub 0.3/GaAs/In/sub 0.15/GaAs/GaAs and In/sub 0.52/AlAs/In/sub 0.65/GaAs/InP HEMTs
This paper describes a comparative analysis of the high frequency performance of 80-200 nm gate length high electron mobility transistors (HEMTs) fabricated on three material structures having different 2 dimensional electron gas (2DEG) transport properties. The higher effective velocity of carriers in the channel of pseudomorphic InGaAs/InP devices resulted in 80 nm gate length devices with f/sub T/'s of 275 GHz. Device output resistance was found to be strongly material dependent. At the shortest gate lengths, the device f/sub max/ was limited primarily by the gate resistance. Additionally however, f/sub max/ was significantly affected by both the contribution of the gate drain capacitance to the total gate capacitance and the magnitude of the output resistance.<>
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