新型羟基苯基磷卟啉自组装单分子膜在Finfets中的适形n型掺杂

Tejas R. Naik, R. Krishnan, Priyanka Kumari, M. Ravikanth, V. Rao
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引用次数: 2

摘要

可控和选择性的掺杂过程是当前CMOS技术的关键,随着finfet的出现,对适形掺杂的必要性已成为不可避免的。在这项工作中,我们证明了在硅衬底上形成新的磷卟啉自组装单层(SAMs),以掺杂磷(n型掺杂)。利用接触角、FTIR、UV-Vis等方法对在硅上形成的地对空导弹进行了详细的物理表征。使用SIMS和四探针测量(薄片电阻)证实了掺杂。MISCAP器件,pn结二极管使用上述技术制造和表征使用电容电压(CV)和电流电压(IV)测量。利用SAM层在三维鳍状结构中掺杂。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Novel hydroxy-phenyl phosphorus porphyrin self-assembled monolayers for conformal n-type doping in Finfets
A controllable and selective process for doping is essential for current CMOS technology, and with the advent of FinFETs, necessity for conformal doping has become inevitable. In this work, we demonstrate formation of novel phosphorus porphyrin self-assembled monolayers(SAMs) on silicon substrate to dope silicon with phosphorus (n-type doping). Detailed physical characterization of SAMs formed on silicon is done using contact angle, FTIR, UV-Vis, etc. The doping is confirmed using SIMS and four-probe measurement (sheet resistance). MISCAP devices, pn junction diodes using the above technique are fabricated and characterized using capacitance-voltage (CV) and current-voltage (IV) measurements. SAM layer is utilized for doping in 3D fin like structures.
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