采用回转速率监测电路的片上工艺变化检测

Amlan Ghosh, R. Rao, Jae-Joon Kim, C. Chuang, Richard B. Brown
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引用次数: 29

摘要

在纳米设计时代,对有效和准确的检测方案的需求增加了,以减轻工艺变化对集成电路参数良率的影响。本文提出了一种新的变化检测技术,该技术将转动与延迟作为度量来确定NMOS器件和PMOS器件的驱动强度之间的不匹配。说明了考虑这两个指标的重要性,并提出了一种新的慢速监测电路,用于测量电路关键路径信号的摆幅。介绍了45 nm SOI技术下的慢速监测电路的设计思想、仿真结果和特性,实现了1 MHz/ps的灵敏度。该方案可以检测到mV量级的阈值电压变化,灵敏度为0.95 MHz/mV。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On-Chip Process Variation Detection Using Slew-Rate Monitoring Circuit
The need for efficient and accurate detection schemes to mitigate the impact of process variations on the parametric yield of integrated circuits has increased in the nm design era. In this paper, a new variation detection technique is presented that uses slew as a metric along with delay to determine the mismatch between the drive strengths of NMOS and PMOS devices. The importance of considering both of these metrics is illustrated and a new slew-rate monitoring circuit is presented for measuring slew of a signal from the critical path of a circuit. Design considerations, simulation results and characteristics of the slew-rate monitor circuitry in a 45 nm SOI technology are presented, and a sensitivity of 1 MHz/ps is achieved. This scheme can detect the threshold voltage variation in the order of mV, with a sensitivity of 0.95 MHz/mV.
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