高性能InGaAs mosfet的生长过程

Y. Miyamoto, T. Kanazawa, Y. Yonai, K. Ohsawa, Y. Mishima, T. Irisawa, M. Oda, T. Tezuka
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引用次数: 0

摘要

为了在nmosfet中获得高性能,引入高迁移率通道材料(如InGaAs)是一种很有前途的方法。然而,在InGaAs中通过离子注入无法获得高驱动电流所需的源掺杂浓度。在III-V型半导体mosfet中实现高掺杂源的一种方法是通过生长外延源/漏极结构为了实现这样一个源,我们使用了一个再生的InGaAs源2、3和一个InP源4再生源对于3D或多栅极器件的高电流驱动性也很重要。多栅器件再生的另一个优点是表面光滑,电子迁移率高在本报告中,我们描述了高性能InGaAs mosfet的生长过程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Growth process for high performance of InGaAs MOSFETs
To obtain high performance in nMOSFETs, the introduction of high-mobility channel material such as InGaAs is a promising approach. However, the required source doping concentration for a high driving current cannot be obtained by ion implantation in InGaAs. One method of achieving a heavily doped source in III-V semiconductor MOSFETs is by growing an epitaxial source/drain structure.1 For realizing such a source, we used a regrown InGaAs source2,3 and an InP source.4 The regrown sources are also important for high current drivability of 3D or multi-gate devices. The other advantage of regrowth in multi-gate devices is a smooth surface for high electron mobility.5 In this report, we describe the growth process for high-performance InGaAs MOSFETs.
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