新一代mos结构参数的光电测量方法

H. Przewlocki
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引用次数: 0

摘要

新一代MOS(金属氧化物半导体)系统的光电测量方法得到了发展。这些方法是基于对介电层中低电场发生的光电现象的一种新方法。概述了这种方法的基本特点,重点介绍了它的实际应用。提出了一些新的测量方法的基本原理,强调了有效接触电位差(ECPD或PhiMS)测定方法的重要性。该方法是现有PhiMS测定方法中灵敏度最高、准确度最高的。这些测量方法最近得到了改进,允许首次确定MOS结构栅极区域上局部PhiMS值的分布。测定了金属栅和硅栅MOS结构的phims值分布。并对所得结果进行了比较。还开发了确定栅极介电和半导体介电界面势垒高度局域值分布的方法。给出了这种分布的例子,并讨论了其原因和后果
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The new generation of the photoelectric measurement methods of mos structure parameters
New generation of MOS (metal-oxide-semiconductor) system photoelectric measurement methods has been developed. These methods are based on a new approach to the photoelectric phenomena occurring at low electric fields in the dielectric layer. Basic features of this approach were outlined, with the emphasis on its practical applications. Principles underlying some of the new measurement methods were presented, underscoring the importance of the effective contact potential difference (ECPD or PhiMS) determination method. This method is the most sensitive and accurate of the existing methods of PhiMS determination. These measurement methods have been recently improved, allowing for the first time, to determine distributions of local PhiMS values over the gate area of MOS structures. Distributions of PhiMSvalues were determined for metal-gate and silicon-gate MOS structures. Comparison of the results obtained was presented. Methods were also developed to determine distributions of potential barrier height local values at gate-dielectric and semiconductor-dielectric interfaces. Examples of such distributions were given and their causes, as well as consequences were discussed
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