{"title":"硅超结mosfet的结构和世代损耗","authors":"G. Zulauf, J. Rivas-Davila","doi":"10.1109/ISPSD.2018.8393621","DOIUrl":null,"url":null,"abstract":"The superjunction (SJ) structure breaks the unipolar material limit of silicon power MOSFETs, and has achieved widespread adoption in commercial power converters. In resonant applications, these SJ devices experience losses due to charging and discharging the parasitic output capacitor, Coss, resulting in losses that increase with switching frequency. We document COSS losses in commercially-available 600 V superjunction devices, showing that even devices grown with the trench-filling epitaxial method have non-negligible losses in MHz converters. Further, progressing in generations within a manufacturer appears to correspond to higher COSS losses as the cell pitch is reduced and doping is increased. The COSS losses may exceed conduction losses in many applications for the devices tested here.","PeriodicalId":166809,"journal":{"name":"2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD)","volume":"2017 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Coss losses in silicon superjunction MOSFETs across constructions and generations\",\"authors\":\"G. Zulauf, J. Rivas-Davila\",\"doi\":\"10.1109/ISPSD.2018.8393621\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The superjunction (SJ) structure breaks the unipolar material limit of silicon power MOSFETs, and has achieved widespread adoption in commercial power converters. In resonant applications, these SJ devices experience losses due to charging and discharging the parasitic output capacitor, Coss, resulting in losses that increase with switching frequency. We document COSS losses in commercially-available 600 V superjunction devices, showing that even devices grown with the trench-filling epitaxial method have non-negligible losses in MHz converters. Further, progressing in generations within a manufacturer appears to correspond to higher COSS losses as the cell pitch is reduced and doping is increased. The COSS losses may exceed conduction losses in many applications for the devices tested here.\",\"PeriodicalId\":166809,\"journal\":{\"name\":\"2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD)\",\"volume\":\"2017 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.2018.8393621\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2018.8393621","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Coss losses in silicon superjunction MOSFETs across constructions and generations
The superjunction (SJ) structure breaks the unipolar material limit of silicon power MOSFETs, and has achieved widespread adoption in commercial power converters. In resonant applications, these SJ devices experience losses due to charging and discharging the parasitic output capacitor, Coss, resulting in losses that increase with switching frequency. We document COSS losses in commercially-available 600 V superjunction devices, showing that even devices grown with the trench-filling epitaxial method have non-negligible losses in MHz converters. Further, progressing in generations within a manufacturer appears to correspond to higher COSS losses as the cell pitch is reduced and doping is increased. The COSS losses may exceed conduction losses in many applications for the devices tested here.