LGA焊点对2片陶瓷LED组件板级可靠性的几何影响

Jing Zhang, Guoqi Zhang
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引用次数: 2

摘要

在本文中,采用我们从之前的工作中导出的方法,研究了2-pad LED照明组件中新定义的焊料几何因素对陆网阵列焊点可靠性的影响。通过一系列有限元模拟,建立了LED封装几何参数的响应面模型,以预测焊点可靠性。结果表明,LED载流子尺寸(A)和焊料覆盖面积(SC)是影响器件性能的主要因素。减小封装尺寸和增加焊料覆盖面积可以延长寿命。此外,在较大的载流子尺寸和焊料覆盖范围下,两个焊点之间的面积比(AR)对可靠性也有很大的影响。研究发现,为了最大限度地减少接头的疲劳损伤积累,采用小载体尺寸、大焊料覆盖面积和等焊盘尺寸的封装设计是可取的。鉴于SC的影响在较小的封装中是边际的,从降低成本的角度来看,建议采用中间焊料覆盖水平。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Geometric effects of LGA solder joint on board level reliability in 2-pad ceramic LED assembly
In this paper, the effects of newly defined solder geometric factors in a 2-pad LED lighting assembly on the reliability of Land Grid Array solder joints are investigated by adopting the methodology that we derived from our previous work. This has been done by conducting a series of FEM simulations to establish a response surface model for LED package geometric parameters to predict solder joint reliability. It shows that the LED carrier size (A) and solder coverage (SC) are the most influential factors. Decreasing the package size and increasing the solder coverage area can prolong the lifetime. Besides, it shows that the area ratio between two solder joints (AR) also affects the reliability greatly at large carrier size and solder coverage. It is found that in order to minimize the fatigue damage accumulation in the joints, a package design with a small carrier size, large solder coverage and equal pad size is preferable. Given the fact that the effect of SC is marginal in smaller packages, from a cost reduction point of view, intermediate solder coverage level is suggested.
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