{"title":"精密VLSI横切与染色","authors":"T. Mills","doi":"10.1109/irps.1983.362006","DOIUrl":null,"url":null,"abstract":"Last year precision VLSI cross-sectioning and staining was introduced to IEEE IRPS. Included in this year's paper is how to implement a 4X productivity improvement of this cross-sectioning technique. Staining techniques are broken down so a failure analyst and/or process engineer can easily formulate and fine tune a stain, also a list of most commonly used stain formulations.","PeriodicalId":334813,"journal":{"name":"21st International Reliability Physics Symposium","volume":"4052 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Precision VLSI Cross-Sectioning and Staining\",\"authors\":\"T. Mills\",\"doi\":\"10.1109/irps.1983.362006\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Last year precision VLSI cross-sectioning and staining was introduced to IEEE IRPS. Included in this year's paper is how to implement a 4X productivity improvement of this cross-sectioning technique. Staining techniques are broken down so a failure analyst and/or process engineer can easily formulate and fine tune a stain, also a list of most commonly used stain formulations.\",\"PeriodicalId\":334813,\"journal\":{\"name\":\"21st International Reliability Physics Symposium\",\"volume\":\"4052 3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"21st International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/irps.1983.362006\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"21st International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/irps.1983.362006","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Last year precision VLSI cross-sectioning and staining was introduced to IEEE IRPS. Included in this year's paper is how to implement a 4X productivity improvement of this cross-sectioning technique. Staining techniques are broken down so a failure analyst and/or process engineer can easily formulate and fine tune a stain, also a list of most commonly used stain formulations.
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