{"title":"用于电路仿真的多晶硅薄膜晶体管物理模型","authors":"C. Li, K. Ikeda, T. Inoue, P. Ko","doi":"10.1109/IEDM.1993.347302","DOIUrl":null,"url":null,"abstract":"This paper presents a poly-silicon thin film transistor model for circuit simulations. The drain current model includes the effects of hot carriers, drain induced barrier lowering (DIBL), channel length modulation (CLM), and gate induced drain leakage (GIDL). The capacitance model is weakly linked to the drain current and its derivatives. This model has been implemented in a SPICE simulation and experimental results are compared.<<ETX>>","PeriodicalId":346650,"journal":{"name":"Proceedings of IEEE International Electron Devices Meeting","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"A physical poly-silicon thin film transistor model for circuit simulations\",\"authors\":\"C. Li, K. Ikeda, T. Inoue, P. Ko\",\"doi\":\"10.1109/IEDM.1993.347302\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a poly-silicon thin film transistor model for circuit simulations. The drain current model includes the effects of hot carriers, drain induced barrier lowering (DIBL), channel length modulation (CLM), and gate induced drain leakage (GIDL). The capacitance model is weakly linked to the drain current and its derivatives. This model has been implemented in a SPICE simulation and experimental results are compared.<<ETX>>\",\"PeriodicalId\":346650,\"journal\":{\"name\":\"Proceedings of IEEE International Electron Devices Meeting\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-12-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE International Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.1993.347302\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE International Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.1993.347302","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A physical poly-silicon thin film transistor model for circuit simulations
This paper presents a poly-silicon thin film transistor model for circuit simulations. The drain current model includes the effects of hot carriers, drain induced barrier lowering (DIBL), channel length modulation (CLM), and gate induced drain leakage (GIDL). The capacitance model is weakly linked to the drain current and its derivatives. This model has been implemented in a SPICE simulation and experimental results are compared.<>