DRAM结构串扰噪声的研究

M. Redeker, B. Cockburn, D. Elliott
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引用次数: 42

摘要

2001年ITRS路线图预测,至少在未来15年内,将继续在深亚微米线宽方面取得积极进展。在本文中,我们描述了一项模拟研究的结果,研究了DRAM字线和位线之间的串扰对路线图预测的当前和未来技术节点的影响。利用模拟模拟器在时域上求解由麦克斯韦方程组导出的相关传输线方程。因此,我们不仅要考虑互连电阻和电容,还要考虑电感和实际的波传播效应。仿真模型的电路参数是从路线图数据隐含的标准DRAM几何形状中提取的。然后对不同的位线-位线和字线-字线耦合场景进行了仿真研究。我们的研究结果表明,直到22纳米节点,单位线扭转将继续有效地对抗位线-位线耦合,但字线-字线耦合效应将变得更加成问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An investigation into crosstalk noise in DRAM structures
The 2001 ITRS roadmap predicts continued aggressive progress towards deep submicron linewidths for at least the next 15 years. In this article we describe the results of a simulation study into the effects of crosstalk among DRAM wordlines and bitlines for present and future technology nodes predicted by the roadmap. An analog simulator was used to solve the associated transmission line equations derived from Maxwell's equations in the time domain. Hence, we not only considered interconnect resistances and capacitances, but also inductances and realistic wave propagation effects. The circuit parameters of the simulation models were extracted from standard DRAM geometries implied by the roadmap data. Various bitline-bitline and wordline-wordline coupling scenarios were then studied in simulation. Our results suggest that down until the 22-nm node, single bitline twisting will continue to be effective against bitline-bitline coupling, but that wordline-wordline coupling effects will become more problematic.
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