在点蚀锗缓冲层上生长出低螺纹位错密度的锗薄膜

B. Cheng, H. Xue, D. Hu, G. Han, Y. Zeng, A. Bai, C. Xue, L. Luo, Y. Zuo, Q.M. Wang
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引用次数: 8

摘要

当生长温度降低到290℃时,可以得到具有点蚀表面的Ge层。在带坑的低温Ge缓冲层上,在600℃下生长出高质量的Ge层,其位错密度为~1倍105cm-2。根据通道和随机卢瑟福后向散射光谱,在Ge/Si界面和表面峰下,分别发现了10%和3.9%的chimin值。Ge膜表面均方根粗糙度为0.33 nm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low threading-dislocation-density Ge film on Si grown on a pitting Ge buffer layer
A Ge layer with a pitting surface can be obtained when the growth temperature is lowered to 290degC. On the low temperature Ge buffer layer with pits, high quality Ge layer was grown at 600degC with a threading dislocation density of ~1times105cm-2. According to channeling and random Rutherford backscattering spectrometry spectra, a chimin value of 10% and 3.9% was found, respectively, at the Ge/Si interface and immediately under the surface peak. The root-mean-square surface roughness of Ge film was 0.33 nm.
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