Dfm -无晶圆厂的观点

J. Khare
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引用次数: 0

摘要

在过去的十年里,无晶圆厂模式对IC公司来说已经证明是非常成功的。然而,在较小的几何形状中,过程设计交互会导致设计边际性和可靠性失效。本文认为,无晶圆厂公司需要系统地应用DFM技术来减少这种(潜在的灾难性)故障。随着集成电路制造技术转向0.13微米及以下,工艺设计交互变得非常复杂。芯片上的工艺变化,模式相关的故障,通过故障率的增加等使得使用“简化”设计规则将工艺与设计分开变得更加困难。此外,过程斜坡变得更长,迫使设计进入不太稳定的过程。对于无晶圆厂公司的工程师来说,这样的范例是新的,他们传统上通过设计规则和过程角的接口与过程隔离。因此,越来越多的soc是由无晶圆厂公司在不了解工艺设计交互的情况下设计的,从而导致
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Dfm - a fabless perspective
The fabless model has proven immensely successful for IC companies over the last decade. However, at smaller geometries, process-design interactions are causing design marginality and reliability failures. This paper argues that systematic application of DFM techniques is needed in fabless companies to reduce such (potentially catastrophic} failures. As IC manufacturing technology shifts to 0.13um and below, process-design interactions are becoming very complex. On-chip process variations, pattem-dependent failures, increased via failure rate, etc. are making it harder to separate the process from design using "simplified" design rules. In addition, process ramps have become longer, forcing designs into not-so-stable processes. Such a paradigm is new for engineers in fabless companies, who have traditionally been isolated from the process through the interface of design rules and process comers. As a result, an increasing number of SoCs are being designed by fabless companies without understanding the process-design interaction, resulting in
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