电子束制备igfet

B. El-Kareh, R. Leone, C. Ting
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引用次数: 2

摘要

对igfet电子束图定义的关注之一是辐射对传输特性的影响。利用电子束光刻技术制备了几种具有不同栅极结构的器件。对结构进行了描述,重点是水平几何形状。然后讨论了关键器件参数,并与传统光刻技术制备的igfet进行了比较,也与传统的电子辐射器件进行了比较。显示了几种退火条件后的器件特性。结果表明,在MOS结构上可以完全消除辐射效应;然而,在具有垂直结构的MNOS和SNOS器件上观察到残留效应。提出了辐射效应和退火行为的模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electron beam fabricated IGFETs
One of the concerns with electron beam pattern definition of IGFETs is the effect of radiation on transfer characteristics. Several types of devices with different gate structures have been fabricated using electron beam lithography. A description of the structures is presented with emphasis on horizontal geometries. The critical device parameters are then discussed and compared with those of IGFETs fabricated with conventional photolithography, and also with conventional devices subjected to electron radiation. Device characteristics are shown after several annealing conditions. It is found that radiation effects can be removed totally on MOS structures; however, residual effects are observed on MNOS and SNOS devices having vertical structures as described. A model for radiation effects and annealing behavior is presented.
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