CPU封装冷却应用的高性能热润滑脂的评估

Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005. Pub Date : 2005-03-15 DOI:10.1109/STHERM.2005.1412157

M. Stern, V. Gektin, S. Pecavar, D. Kearns, T. Chen

{"title":"CPU封装冷却应用的高性能热润滑脂的评估","authors":"M. Stern, V. Gektin, S. Pecavar, D. Kearns, T. Chen","doi":"10.1109/STHERM.2005.1412157","DOIUrl":null,"url":null,"abstract":"High performance thermal greases have been evaluated in three separate environments: ideal laboratory, in situ laboratory, and system mockup testing to better understand how bulk and interfacial thermal properties, in combination with the test vehicles used, effect the resultant thermal performance. The three methodologies are described and measurements on a baseline material reported.","PeriodicalId":256936,"journal":{"name":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","volume":"137 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Evaluation of high performance thermal greases for CPU package cooling applications\",\"authors\":\"M. Stern, V. Gektin, S. Pecavar, D. Kearns, T. Chen\",\"doi\":\"10.1109/STHERM.2005.1412157\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High performance thermal greases have been evaluated in three separate environments: ideal laboratory, in situ laboratory, and system mockup testing to better understand how bulk and interfacial thermal properties, in combination with the test vehicles used, effect the resultant thermal performance. The three methodologies are described and measurements on a baseline material reported.\",\"PeriodicalId\":256936,\"journal\":{\"name\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"volume\":\"137 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2005.1412157\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2005.1412157","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 5

摘要

高性能热润滑脂在三种不同的环境下进行了评估:理想实验室、现场实验室和系统模型测试，以更好地了解总体和界面热性能，以及所使用的测试工具对最终热性能的影响。描述了这三种方法，并报告了基线材料的测量结果。

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Evaluation of high performance thermal greases for CPU package cooling applications

High performance thermal greases have been evaluated in three separate environments: ideal laboratory, in situ laboratory, and system mockup testing to better understand how bulk and interfacial thermal properties, in combination with the test vehicles used, effect the resultant thermal performance. The three methodologies are described and measurements on a baseline material reported.

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Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.

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