氮化硅封装对MOS器件稳定性的影响

R. C. Sun, J. Clemens, J. T. Nelson
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引用次数: 26

摘要

在等离子体沉积氮化硅薄膜封装的Sigate MOS晶体管中,发现了一种新的阈值不稳定现象。当MOSFET在高漏极电压下工作时,观察到饱和模式阈值漂移高达¿0.5V。通过一系列的实验得出结论,这种不稳定性是由于氮化膜中与氢有关的化学效应。热载流子与界面上存在的氢相互作用,在通道区域形成表面态和固定电荷,被认为是其基本机理。实验结果与电压,时间和器件几何,将讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of Silicon Nitride Encapsulation on MOS Device Stability
A new threshold instability phenomenon has been observed in Sigate MOS transistors encapsulated with plasma deposited silicon nitride films. The saturation mode threshold has been observed to drift as much as ¿0.5V when the MOSFET is operating with high drain voltage. Through a series of experiments it is concluded that this instability is due to a chemical effect associated with hydrogen in the nitride films. The formation of surface states and fixed charges in the channel region due to the-interaction of hot carriers with hydrogen present at the interface is proposed to be the basic mechanism. Experimental results with respect to voltage, time and device geometry, will be discussed.
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