表面钝化层缺陷对铝集成电路金属化的腐蚀

18th International Reliability Physics Symposium Pub Date : 1980-04-01 DOI:10.1109/IRPS.1980.362955

R. Comizzoli, L. White, W. Kern, G. Schnable, D. Peters, C. Tracy, R. D. Vibronek

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引用次数: 15

摘要

测定了PSG和氮化硅钝化铝纹的腐蚀速率和腐蚀电流。报告了腐蚀与温度、相对湿度、铝沉积方法、合金化处理、钝化层类型、缺陷密度和污染物等参数的关系。还讨论了降低腐蚀电流的表面处理方法。

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Corrosion of Aluminum IC Metaillization with Defective Surface Passivation Layer

Corrosion rates and corrosion current of aluminum line patterns passivated with PSG and silicon nitride were measured. Relationships between corrosion and various parameters including temperature, relative humidity, aluminum deposition method, alloying treatment, passivation layer type and defect density and contaminants are reported. A surface treatment which lowers corrosion currents is also discussed.

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18th International Reliability Physics Symposium

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