大挑战:CMOS片上系统硬件和软件应用发展的未来

B. Von Herzen, M. Lerer
{"title":"大挑战:CMOS片上系统硬件和软件应用发展的未来","authors":"B. Von Herzen, M. Lerer","doi":"10.1109/DCAS.2006.321032","DOIUrl":null,"url":null,"abstract":"CMOS technology trends are forcing system designers to use multiple processors on a single die to meet power performance objectives. Power performance optimization also leads to heterogeneous combinations of processors, DSP units, ASSPs and FPGAs. Both of these trends exacerbate the crisis in software productivity. New tools, languages and implementation techniques must be utilized to ensure achievement of time-to-market objectives for today's system-on-chip designs. Several examples are included to illustrate the problems, issues and opportunities as systems on chips drive towards hundreds of concurrent processes. These issues and their successful resolution are expected to cut across hardware and software boundaries and pervade the electronics industry as the drive for power performance continues over the coming decade","PeriodicalId":244429,"journal":{"name":"2006 IEEE Dallas/CAS Workshop on Design, Applications, Integration and Software","volume":"54 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Grand Challenge: The Future of CMOS System-on-Chip Hardware and Software Application Development\",\"authors\":\"B. Von Herzen, M. Lerer\",\"doi\":\"10.1109/DCAS.2006.321032\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"CMOS technology trends are forcing system designers to use multiple processors on a single die to meet power performance objectives. Power performance optimization also leads to heterogeneous combinations of processors, DSP units, ASSPs and FPGAs. Both of these trends exacerbate the crisis in software productivity. New tools, languages and implementation techniques must be utilized to ensure achievement of time-to-market objectives for today's system-on-chip designs. Several examples are included to illustrate the problems, issues and opportunities as systems on chips drive towards hundreds of concurrent processes. These issues and their successful resolution are expected to cut across hardware and software boundaries and pervade the electronics industry as the drive for power performance continues over the coming decade\",\"PeriodicalId\":244429,\"journal\":{\"name\":\"2006 IEEE Dallas/CAS Workshop on Design, Applications, Integration and Software\",\"volume\":\"54 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 IEEE Dallas/CAS Workshop on Design, Applications, Integration and Software\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DCAS.2006.321032\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE Dallas/CAS Workshop on Design, Applications, Integration and Software","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DCAS.2006.321032","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

CMOS技术的发展趋势迫使系统设计人员在单个芯片上使用多个处理器来满足功耗性能目标。功率性能优化还导致处理器、DSP单元、assp和fpga的异构组合。这两种趋势都加剧了软件生产力的危机。必须利用新的工具、语言和实现技术来确保实现当今片上系统设计的上市时间目标。包括几个例子来说明问题,问题和机遇的芯片上的系统驱动到数百个并发进程。这些问题及其成功的解决方案预计将跨越硬件和软件的界限,并在未来十年继续推动电力性能,遍及电子行业
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Grand Challenge: The Future of CMOS System-on-Chip Hardware and Software Application Development
CMOS technology trends are forcing system designers to use multiple processors on a single die to meet power performance objectives. Power performance optimization also leads to heterogeneous combinations of processors, DSP units, ASSPs and FPGAs. Both of these trends exacerbate the crisis in software productivity. New tools, languages and implementation techniques must be utilized to ensure achievement of time-to-market objectives for today's system-on-chip designs. Several examples are included to illustrate the problems, issues and opportunities as systems on chips drive towards hundreds of concurrent processes. These issues and their successful resolution are expected to cut across hardware and software boundaries and pervade the electronics industry as the drive for power performance continues over the coming decade
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信