{"title":"微型组合滤波器的晶圆级制造与封装","authors":"S. Mehta, P. Petre","doi":"10.1109/EPEP.2007.4387135","DOIUrl":null,"url":null,"abstract":"We will report on HRL Laboratories' progress in developing state-of-the-art, extremely miniature, combline filters. These filters utilize standard semiconductor substrates, and are fabricated and packaged at the wafer-level -this ensures high reproducibility in device performance, and allows large scale production at a significant cost reduction. The salient filter features are: small size, low insertion loss, tunability, high EM isolation, high power handling capability, and high out of band rejection.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Wafer Level Fabrication and Packaging of Miniature Combline Filters\",\"authors\":\"S. Mehta, P. Petre\",\"doi\":\"10.1109/EPEP.2007.4387135\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We will report on HRL Laboratories' progress in developing state-of-the-art, extremely miniature, combline filters. These filters utilize standard semiconductor substrates, and are fabricated and packaged at the wafer-level -this ensures high reproducibility in device performance, and allows large scale production at a significant cost reduction. The salient filter features are: small size, low insertion loss, tunability, high EM isolation, high power handling capability, and high out of band rejection.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387135\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387135","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Wafer Level Fabrication and Packaging of Miniature Combline Filters
We will report on HRL Laboratories' progress in developing state-of-the-art, extremely miniature, combline filters. These filters utilize standard semiconductor substrates, and are fabricated and packaged at the wafer-level -this ensures high reproducibility in device performance, and allows large scale production at a significant cost reduction. The salient filter features are: small size, low insertion loss, tunability, high EM isolation, high power handling capability, and high out of band rejection.